Bicheng Enterprise Company -

Bicheng Enterprise Company

Showing 1 - 10 of 10, total 1 pages [First] [Previous] [Next] [Last]

rogers pcb
Specification: ROGERS PCB
Detail: 1) RO4350B and RO4003C RO4350B 4mil(0.1mm) 10mil(0.254mm) 13.3mil(0.338mm) 20mil (0.508mm) 30mil(0.762mm) 60mil(1.524mm) RO4003C

via-in-pad pcb
Specification: Via-in-pad PCB
Detail: 1). 80 *190mm/2up, FR-4 2). 6 layers at 1.4mm thick 3). 35 ¦Ìm copper weight 4). Green solder mask LPI/White legend 5). ENIG surface finish 6). Blind via from Layer 1 to layer 2 7). Via in pad plugged conductive resin

heavy copper pcb
Specification: Heavy copper PCB
Detail: 1). 6 oz (210¦Ìm) on BOT side. 2). 139.99*110.85mm=1 pcb 3). Base material: FR-4 4). 4 Layer, 1.6mm thick 5). Green solder mask/ white legend 6). Immersion gold. 7). Stack-up ---------- OVERLAY (TOP) ----...

quick turn pcb (fast pcb)
Specification: Quick turn PCB (Fast PCB)
Detail: 1). Size: 72*90mm/1 up 2). Layer count: 4 Layer, 20 ¦Ìm PTH 3). Thickness: 1.6mm +/- 10% 4). Copper weight(Finished): 35 ¦Ìm 5). SMOBC: LPI Green solder mask/ White legend 6). Holes: 0.4mm minimum, 4/4 mil track/***ce 7...

blind via pcb
Specification: Blind via PCB
Detail: 1). 1+C+1 HDI, buried/blind L1-L5/L5-L8 vias. 2). FR-4 Material, 1 oz weight. 3). 8 layer, 1.6mm thick. 4). 4/4 mils track and ***ce 5). Min.drill 0.1mm 6). Green solder mask/ white silkscreen 7). Immersion gold over nic...

high tg pcb
Specification: High Tg PCB
Detail: 1). 90*90mm/1up, ITEQ IT180A, FR-4 Tg170 2). 10 layer, 1.6mm thick 3). 35 ¦Ìm copper finished 4). LPI Green solder mask/ white legend 5). Immersion gold (ENIG) 6). Differential impedance control 90 ohm/100 ohm +/-10% on t...

pcb prototypes
Specification: PCB prototypes
Detail: 1). PCB prototypes to small volume. 2). FR-4, 0.3-5mm thick, 1-10 oz 3). 1-32 Layer 4). LPI Green solder mask/White legend 5). HASL, ENIG, OSP, Immersion silver 6). Blind via, Via in pad, Micro BGA 7). MOQ 1 PCS

impedance controlled pcb
Specification: Impedance controlled PCB
Detail: 1) L1 and L4, track /***ce(mil) 5.1/6, precision +/-10% 90 ohm differential impedance L1, L2 and L4, track /***ce(mil) 6.1/7.8, precision +/-10% 100 ohm differential impedance 2). 230*230mm/1up, FR-4 Tg 170 3). 4...

high cti pcb
Specification: High CTI PCB
Detail: 1) 160*160mm, S1600 FR-4 CTI ¡Ý 600V, 2) 8 layer 3) Finished inner/outer: 35 ¦Ìm 4) LPI Green mask/white silk 5) Min hole 0.19mm, 5/3 track/gap 6) 1.6mm +/-10% thick 7) Immersiong gold over nickel 8) High voltage, Hig...

double sided mcpcb
Specification: Double sided MCPCB
Detail: 1. Aluminum core, 125*73mm=1PCB 2. Double sided 3. Thermal conductivity: 2.0W/MK 4. Green solder mask/ white text 5. 2 OZ copper finished 6. 2.4mm finished thickness 7. Immersion Gold 8. Plated through hole (PTH) 9. la...


Showing 1 - 10 of 10, total 1 pages [First] [Previous] [Next] [Last]
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